Report Shows TSMC Hitting Demand Maximum
Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly reaching its limit for supply chain demand, creating bottlenecks for the first time in the company’s history. As demand if AI chips grows, the company that once thought it would never hit capacity is now falling behind. In a report in Reuters, the strain is forcing TSMC to build more facilities by the end of next year. TSMC announced it was struggling with demand earlier this year, as the AI infrastructure grow at a rapid pace. The company is continuing its partnerships with Nvidia and Apple. Business News Today – tEDmag


Apple is expected to launch its first foldable smartphone in 2026, and competition among potential component suppliers is already intensifying. According to Patently Apple, which cited a well-known analyst, Samsung Display is likely to supply a crease-free display solution for the device. The internal hinge, according to the report, plays a crucial role in minimizing screen creases when the device is unfolded. TrendForce’s latest investigations reveal that the anticipated launch of Apple’s first foldable device in the second half of 2026 is expected to lift foldable phone penetration from 1.6% in 2025 to over 3% in 2027. According to TrendForce, the global foldable hinge market is projected to reach US$1.2 billion in 2025, with hinges currently accounting for about 5–8% of the BOM cost per device. 